Pulsed heated hot bar reflow soldering is hot bar soldering equipment in which two solder plated parts are pressed together and heated to a temperature adequate to result in the solder to melt and flow, then the various components are cooled to form a permanent electro-mechanical bond. Pulsed heated soldering is different from traditional soldering for the reason that reflow of solder is accomplished using a heating element known as a “thermode” which happens to be quickly heated and then cooled off for each connection contributing to strong joints. Pressure is used through the entire entire cycle leading to precise positioning. In addition, it helps make the process ideal for parts that could otherwise disconnect during cool down. Hot bar reflow soldering is another sensible choice for applications that require multiple connections being made simultaneously; around 200 leads or wires could be connected in just one process cycle. Hot bar reflow soldering processes are reproducible, quantifiable, and traceable to quality standards including ISO / NIST. Hot Bar reflow soldering is protected, highly operator-independent as well as simple to automate.
Heat seal bonding – also referred to as ACF bonding – is the procedure of producing electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils with very fine pitch (<30 micron). The essential characteristics of pulse heat bonding machine are heating and cooling of the adhesive under pressure.
Heatstaking is a method of joining two or more parts, where at least one is made out of plastic. The bond is made by partially de-forming the plastic part to fix the other. Heatstaking is the most efficient way to bond metal to plastic, and is commonly used in high volume/low cost applications in the automotive, telecom and 16dexgpky industries. The process works by heating the plastic to a temperature above the glass transition temperature via the use of super-heated air or a thermode, and then applying pressure in order to deform it and create the stake. The plastic is then cooled down again – under constant pressure – below the glass transition temperature, ensuring good fixation of the parts. This cooling can be done with compressed air if using a thermode, or with a cold, preformed tool if super-heated air is used.
Amada Miyachi offers a full line of automatic soldering machine, bonding heads for benchtop use or for integration or automation, thermodes, and both standard and custom systems for reflow soldering, heat seal bonding and heat staking.